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      1. 焊錫機的焊膏選擇應該如何選擇


          在自動焊錫機焊接過程中焊膏是必不可少的助焊劑,好的焊膏不但可以增加我們焊錫的效率,還能有效的延長烙鐵頭的使用壽命。
         
          其實我們選擇焊膏主要根據根據產品本身的價值和用途、表面組裝板的組裝密度、PCB和元器件存放時間和表面氧化程度、生產線工藝條件等實際情況來選擇焊膏,不同的產品要選擇不同的焊膏。
         
          In the automatic soldering machine welding process, solder paste is essential flux, good solder paste can not only increase the efficiency of our solder, but also effectively prolong the service life of the soldering iron head. In fact, we choose the main solder paste solder paste to choose according to the actual situation according to the value of the product itself and use, surface mount board density assembly, PCB and devices, storage time and surface oxidation degree and production process conditions etc.. Different products should choose different solder paste.
         
         
          焊膏合金粉末的組分、純度及含氧量、顆粒形狀和尺寸、焊劑的成分與性質等是決定焊膏特性以及焊點質量的關鍵因素
         
          The components, purity and oxygen content, particle shape and size, composition and properties of solder paste are the key factors to determine solder paste characteristics and solder joint quality.
         
          a 根據產品本身的價值和用途,高可靠性的產品需要高質量的焊膏
         
          A according to the value and use of the product itself, high reliability products need high quality solder paste.
         
          b 根據PCB和元器件存放時間和表面氧化程度來決定焊膏的活性
         
          B determines the activity of solder paste according to the storage time and surface oxidation degree of PCB and components.
         
          c 根據產品的組裝工藝、印制板、元器件的具體情況選擇焊膏合金組分。
         
          C selects solder paste alloy components according to the product assembly process, the printed circuit board and the components.
         
          d 根據產品(表面組裝板)對清潔度的要求來選擇是否采用免清洗
         
          D according to the product (surface assembly board) requirements for cleanliness to choose whether to use clean.
         
          e BGA和CSP一般都需要采用免清洗焊膏
         
          E BGA and CSP generally need to use clean solder paste
         
          f 焊接熱敏元件時,應選用含鉍的低熔點焊膏。
         
          Bismuth containing low melting point solder paste should be chosen when welding f thermal sensitive components.

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